
The Packaging Process Engineer role supports the AIM Photonics team at NY Creates, a leading hub for advanced electronics and optoelectronic manufacturing. The position involves hands-on development of wire bonding and interconnect processes using state-of-the-art equipment to assemble heterogeneously integrated packages. Key responsibilities include running design of experiments to optimize machine parameters, qualifying materials for solder interconnect integrity, and performing failure analysis to improve yields. This opportunity appeals to engineers seeking to work at the global epicenter of high-tech innovation within a collaborative, industry-driven environment. The role is based on-site in Rochester, New York, offering access to cutting-edge facilities and a mission focused on advancing national manufacturing leadership.













