Packaging Process Engineer
Not Disclosed•Full-TimeOn-site
location_on166, Cumberland Street, City of Rochester, Monroe County, New York, 14605, United States
NY Creates serves as a bridge for advanced electronics, leading projects that advance R&D in emerging technologies and generating the jobs of tomorrow. The organization runs some of the most advanced facilities in the world, boasts more than 3,000 industry experts and faculty, and manages public and private investments exceeding $25 billion. This places NY Creates at the global epicenter of high-tech innovation and commercialization.
We are seeking a Packaging Process Engineer to join our AIM Photonics team. As one of nine U.S. Department of Defense Manufacturing Innovation Institutes, AIM Photonics operates as an industry-driven, public-private partnership. Its mission is to focus the nation's premier capabilities and expertise to capture critical global manufacturing leadership.
In this hands-on role, you will work directly with advanced solder interconnect equipment and materials for the assembly of optoelectronic packages. You will be part of a dynamic environment where you help build heterogeneously integrated electronic and optoelectronic packages using state-of-the-art equipment at TAP. Your work will involve running Design of Experiments (DOE) to optimize machine parameters, evaluating materials for customer applications, and performing continuous inspection and characterization to ensure process robustness. You will also serve as a technical liaison between marketing, vendors, purchasing, and customers, interpreting failure analysis reports to drive yield improvements and device performance.
If you are excited about working for NY Creates but your experience doesn't align perfectly with every requirement, we encourage you to apply anyway. We are dedicated to building a welcoming team, and you might still be a perfect fit for this or another role.
Please note that this position is contingent on the satisfactory completion of a background check. For positions requiring access to export-controlled commodities or technical data, offers of employment are contingent upon the employer obtaining necessary U.S. Government authorization. The decision to pursue an export license application is at The Research Foundation for SUNY's sole discretion, and proof of status may be required prior to employment.
Employment is with the Research Foundation for SUNY. The Research Foundation is an Equal Opportunity Employer, including individuals with disabilities and protected veterans. In compliance with the Americans with Disabilities Act (ADA), if you have a disability and require a reasonable accommodation to apply, please call Human Resources at 518-437-8686.
Work model: On-site
166, Cumberland Street, City of Rochester, Monroe County, New York, 14605, United States
City of Rochester, New York
5+ years of experience with hands-on wire bonding or active alignment fiber attach. Experience in cleanroom, high precision equipment, inspection, and characterization equipment in semiconductor assembly line. Experience in back-end assembly process including flip-chip bumping, thermal compression bonding, and solder reflow. Experience with flux and fluxless soldering of eutectic solder alloys and intermetallic formation. Experience with failure analysis of solder joints. DOE experience. Excellent oral and written communication skills.
Skills: Wire Bonding, Fiber Attach, Flip-Chip, Solder Attach, Plasma Cleaning, Thermal Compression Bonding, Additive Printing, Dispensing, Solder Reflow, Fluxless Soldering.
Education: Bachelor's degree in mechanical engineering, Material Science, Engineering Physics, or equivalent.
