
This full-time Advanced Packaging Integration Engineer role is based at Applied Materials' Santa Clara headquarters within the Photonics Platform Business Group. The position focuses on developing next-generation silicon photonics packaging technologies, specifically enabling high-performance optical interconnects and co-packaged optics. Key responsibilities include architecting scalable integration flows for 3D heterogeneous integration and die stacking, leading complex technical programs to ensure manufacturability and reliability, and collaborating with foundries and cross-functional teams to resolve technical challenges. The role offers the appeal of working on cutting-edge materials science that drives global AI and IoT innovations within a supportive culture dedicated to employee growth and professional development. While primarily on-site, the position includes approximately 10% travel for collaboration with external partners.


















