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  1. Home
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  5. Advanced Packaging Integration Engineer
Applied Materials logo

Advanced Packaging Integration Engineer

Not Disclosed•Full-TimeOn-site

location_onBerman Building, 1405, Civic Center Drive, Santa Clara, Santa Clara County, California, 95050, United States

Apply Now

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build, and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world, like AI and IoT. If you want to push the boundaries of materials science and engineering to create next-generation technology, join us to deliver material innovation that changes the world.

About the Role

Join the Photonics Platform Business Group within the CTO Office at Applied Materials' Santa Clara headquarters, where you will work with a world-class research team developing next-generation silicon photonics packaging technologies. This role focuses on enabling high-performance optical interconnects and co-packaged optics through innovative advanced packaging and 3D integration solutions.

You will benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible while learning every day in a supportive, leading global company. At Applied Materials, we care about the health and wellbeing of our employees, committed to providing programs and support that encourage personal and professional growth.

Hiring Process

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement. The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

Equal Opportunity

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.

Work location

Work model: On-site

location_on

Berman Building, 1405, Civic Center Drive, Santa Clara, Santa Clara County, California, 95050, United States

Santa Clara, California

Key Responsibilities

  • check_circleDefine, develop, and optimize advanced packaging process integration flows for 3D heterogeneous integration and die stacking
  • check_circleLead and manage complex technical programs to ensure on-time, high-quality deliverables
  • check_circleDesign controlled experiments, collect data, and perform root-cause analysis to implement corrective actions
  • check_circleCollaborate with foundries, OSATs, and research teams to define and implement improved integration methodologies
  • check_circleTrack industry advancements and apply new knowledge to drive innovation in packaging technologies

Requirements

  • verifiedM.S. or Ph.D. in Materials Science, Electrical Engineering, Chemical Engineering, Applied Physics, or related STEM discipline
  • verifiedHands-on experience in advanced packaging technologies (hybrid bonding, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, OSAT processes)
  • verifiedProficiency in statistical analysis and process control (DOE, SPC, JMP)

Nice to Have

Coding experience. Experience with MES systems. Ability to prepare clear, compelling executive-level or customer-facing presentations.

Benefits & Perks

check_circleParticipation in a bonus programcheck_circleParticipation in a stock award program
Applied Materials cover image
Applied Materials logo
Company

Applied Materials

Industry

Semiconductor Manufacturing

Headquarters

Santa Clara, CA

Open Roles

1

We deliver material innovation that changes the world.

Applied Materials specializes in materials engineering solutions critical to semiconductor manufacturing and advanced display technologies. The company’s innovations support the development of next-generation chips and artificial intelligence systems, enabling advancements in global technology infrastructure. Based in Santa Clara, CA, Applied Materials focuses on scientific and engineering breakthroughs to deliver scalable material solutions for the semiconductor industry. Its work underpins progress in computing, energy efficiency, and digital transformation across diverse sectors reliant on cutting-edge electronics. Committed to driving technological evolution, the company collaborates with partners worldwide to address complex challenges in materials science and manufacturing processes.

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Skills, education and keywords

Skills: Materials Science, Electrical Engineering, Chemical Engineering, Applied Physics, Advanced Packaging, Semiconductor Processing, 2.5d/3d Integration, TSV, RDL, Underfill.

Education: M.S. in Materials Science required; Ph.D. in Materials Science required.

Frequently asked questions about Advanced Packaging Integration Engineer at Applied Materials

What does a Advanced Packaging Integration Engineer at Applied Materials do?expand_more
Day-to-day, the Advanced Packaging Integration Engineer at Applied Materials will define, develop, and optimize advanced packaging process integration flows for 3d heterogeneous integration and die stacking; lead and manage complex technical programs to ensure on-time, high-quality deliverables; design controlled experiments, collect data, and perform root-cause analysis to implement corrective actions; and collaborate with foundries, osats, and research teams to define and implement improved integration methodologies.
What are the requirements for this Advanced Packaging Integration Engineer role?expand_more
Applied Materials is looking for candidates who meet the following requirements: M.S. or Ph.D. in Materials Science, Electrical Engineering, Chemical Engineering, Applied Physics, or related STEM discipline; Hands-on experience in advanced packaging technologies (hybrid bonding, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, OSAT processes); and Proficiency in statistical analysis and process control (DOE, SPC, JMP).
Where is the Advanced Packaging Integration Engineer role at Applied Materials located?expand_more
Advanced Packaging Integration Engineer at Applied Materials is based in Berman Building, 1405, Civic Center Drive, Santa Clara, Santa Clara County, California, 95050, United States. This is a on-site role.
Is this Advanced Packaging Integration Engineer job remote, hybrid, or on-site?expand_more
Applied Materials has listed this Advanced Packaging Integration Engineer role as on-site.
How much experience is required for this Advanced Packaging Integration Engineer role?expand_more
Candidates for Advanced Packaging Integration Engineer at Applied Materials should have mid level.
What skills do you need for the Advanced Packaging Integration Engineer role at Applied Materials?expand_more
Key skills for Advanced Packaging Integration Engineer at Applied Materials include Materials Science; Electrical Engineering; Chemical Engineering; Applied Physics; Advanced Packaging; Semiconductor Processing; 2.5d/3d Integration; and TSV.
What education is required for Advanced Packaging Integration Engineer at Applied Materials?expand_more
Educational requirements for this role: M.S. in Materials Science required; and Ph.D. in Materials Science required.
What category does the Advanced Packaging Integration Engineer role belong to?expand_more
Advanced Packaging Integration Engineer at Applied Materials is part of the engineering job category on Recrutus.

About Applied Materials

Applied Materials specializes in materials engineering solutions critical to semiconductor manufacturing and advanced display technologies. The company’s innovations support the development of next-generation chips and artificial intelligence systems, enabling advancements in global technology infrastructure. Based in Santa Clara, CA, Applied Materials focuses on scientific and engineering breakthroughs to deliver scalable material solutions for the semiconductor industry. Its work underpins progress in computing, energy efficiency, and digital transformation across diverse sectors reliant on cutting-edge electronics. Committed to driving technological evolution, the company collaborates with partners worldwide to address complex challenges in materials science and manufacturing processes.

Browse more roles: All Applied Materials jobs, engineering jobs on Recrutus.

Recrutus

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Search roles by city, category, skill, or job type — explore verified US employers, salary benchmarks, and remote-friendly teams hiring nationwide.

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Recrutus helps candidates discover roles that match their skills and helps teams reach qualified applicants faster. Browse by metro, discipline, or work style — from internships to senior leadership.

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View company profilearrow_forwardlanguageWebsitelinkLinkedIn
Quick Overview

Experience

Mid Level

Education

M.S. in Materials Science required

Job Type

Full-Time

Skills Required

Materials ScienceElectrical EngineeringChemical EngineeringApplied PhysicsAdvanced PackagingSemiconductor Processing2.5d/3d IntegrationTSVRDLUnderfill
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