
The Microelectronics Advanced Packaging Engineer role supports the design, analysis, and manufacturing of mechanical systems within a dynamic R&D environment. Key responsibilities include evaluating new packaging materials and processes, developing solutions to optimize Size Weight and Power, and managing the complete packaging assembly lifecycle from concept to prototype. The position requires expertise in flip-chip, BGA, and system-in-package technologies, along with proficiency in eCAD and mCAD software. This opportunity appeals to engineers seeking to work on cutting-edge microelectronics for defense systems in a collaborative culture that values professional growth and work-life balance. The role is available in remote, hybrid, or onsite arrangements depending on specific project needs, with eligibility for a security clearance required.















