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  1. Home
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  3. engineering
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  5. Microelectronics Advanced Packaging Engineer
Booz Allen Hamilton logo

Microelectronics Advanced Packaging Engineer

Not Disclosed•Full-TimeOn-site

location_on3866, Brookshire Drive, Bellbrook, Greene County, Ohio, 45305, United States

Apply Now

About the Role

As a Microelectronics Advanced Packaging Engineer, you will apply principles of engineering physics, mathematics, and materials science to support the design, analysis, and manufacturing of mechanical systems. In this role, you will develop solutions for problems of moderate scope and complexity, working independently while providing guidance to junior employees. You will be instrumental in evaluating new packaging materials, processes, and architectures to align with state-of-the-art technologies in dynamic manufacturing and R&D environments.

Your day-to-day work involves operating and maintaining complex equipment in microelectronics rapid prototyping laboratories. You will manage the complete packaging assembly process from concept to prototype, including equipment and material selection for panel-level, wafer-level, and chip-level systems. This includes expertise in flip-chip, BGA, WLP, system-in-package (SiP), multi-chip modules (MCM), and heterogenous and chiplet integration. A key focus will be developing packaging solutions that optimize Size, Weight, and Power (SWaP) within a high-mix, low-volume R&D setting.

Clearance & Security

Applicants selected for this position will be subject to a security investigation and must meet eligibility requirements for access to classified information. A Secret clearance is required, and candidates may need to obtain one if not already held.

Identity Verification & AI Policy

As part of our hiring process, we utilize advanced biometrics and artificial intelligence to ensure authenticity and protect against identity fraud. Candidates are expected to be on camera during interviews and assessments, and we reserve the right to take pictures to verify identity.

At Booz Allen, AI is a part of our daily work, and we are committed to its responsible and ethical use. However, to ensure a fair candidate process based on your own skills and knowledge, the use of AI tools to assist with responses during interviews is prohibited unless explicit permission is provided.

Work Model

Our people-first culture prioritizes collaboration, whether in person or virtually. Employees working virtually are generally expected to have their cameras on during meetings. Depending on the specific assignment, this role may be Remote, Hybrid, or Onsite.

  • Remote: Occasional in-person work at a Booz Allen or customer facility may be required.
  • Hybrid: Frequent work from a Booz Allen facility is expected, aligned with leadership needs, with potential visits to customer facilities.
  • Onsite: Work will primarily be performed at a Booz Allen office or customer facility to facilitate direct collaboration.

Equal Opportunity Employer

All qualified applicants will receive consideration for employment without regard to disability, status as a protected veteran, or any other status protected by applicable federal, state, local, or international law.

Work location

Work model: On-site

location_on

3866, Brookshire Drive, Bellbrook, Greene County, Ohio, 45305, United States

Bellbrook, Ohio

Key Responsibilities

  • check_circleCollaborate with RF, digital, photonics, and analog designers to tailor packaging designs
  • check_circleDevelop packaging solutions that optimize Size Weight and Power (SWaP) in R&D environments
  • check_circleEvaluate new packaging materials, processes, and architectures for dynamic manufacturing
  • check_circleOperate and maintain complex equipment in microelectronics rapid prototyping laboratories
  • check_circleGuide activities of junior employees while working independently on moderate complexity problems
  • check_circleManage complete packaging assembly processes from concept to prototype for various system levels
  • check_circleApply engineering physics and materials science to design and analyze mechanical systems

Requirements

  • verified2+ years of experience in dynamic manufacturing and R&D environment
  • verifiedExperience in eCAD and mCAD software
  • verifiedExperience with packaging, PCB fabrication, cleanroom processing, or SMT assembly
  • verifiedAbility to obtain a Secret clearance
  • verifiedBachelor's degree in an engineering field

Nice to Have

5+ years of experience with advanced packaging technology innovation and prototyping. Experience collaborating with RF, digital, photonics, and analog designers to tailor packaging designs to application needs. Knowledge of trends related to current and future technologies, including design or prototyping for DoD systems. Secret clearance. Master's degree in an engineering field.

Benefits & Perks

check_circleHealth, life, disability, financial, and retirement benefitscheck_circlePaid leave and professional development programscheck_circleTuition assistance and work-life programscheck_circleDependent care benefitsRecognition awards program for exceptional performance
Booz Allen Hamilton logo
Company

Booz Allen Hamilton

Industry

engineering

View company profilearrow_forwardlanguageWebsite
Quick Overview

Experience

2+ yrs (Mid Level)

Education

Bachelor's degree in an engineering field required

Job Type

Full-Time

Skills Required

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Skills, education and keywords

Skills: Ecad, Mcad, Packaging, PCB Fabrication, Cleanroom Processing, SMT Assembly, Flip-Chip, Bga, WLP, System-In-Package.

Education: Bachelor's degree in an engineering field required; Master's degree in an engineering field preferred.

Frequently asked questions about Microelectronics Advanced Packaging Engineer at Booz Allen Hamilton

What does a Microelectronics Advanced Packaging Engineer at Booz Allen Hamilton do?expand_more
In this Microelectronics Advanced Packaging Engineer at Booz Allen Hamilton role, you will collaborate with rf, digital, photonics, and analog designers to tailor packaging designs; develop packaging solutions that optimize size weight and power (swap) in r&d environments; evaluate new packaging materials, processes, and architectures for dynamic manufacturing; and operate and maintain complex equipment in microelectronics rapid prototyping laboratories.
What are the requirements for this Microelectronics Advanced Packaging Engineer role?expand_more
To qualify for the Microelectronics Advanced Packaging Engineer at Booz Allen Hamilton position, applicants should have: 2+ years of experience in dynamic manufacturing and R&D environment; Experience in eCAD and mCAD software; Experience with packaging, PCB fabrication, cleanroom processing, or SMT assembly; Ability to obtain a Secret clearance; and Bachelor's degree in an engineering field.
Where is the Microelectronics Advanced Packaging Engineer role at Booz Allen Hamilton located?expand_more
Microelectronics Advanced Packaging Engineer at Booz Allen Hamilton is based in 3866, Brookshire Drive, Bellbrook, Greene County, Ohio, 45305, United States. This is a on-site role.
Is this Microelectronics Advanced Packaging Engineer job remote, hybrid, or on-site?expand_more
Booz Allen Hamilton has listed this Microelectronics Advanced Packaging Engineer role as on-site.
How much experience is required for this Microelectronics Advanced Packaging Engineer role?expand_more
Microelectronics Advanced Packaging Engineer at Booz Allen Hamilton typically requires 2+ years of relevant experience at the mid level level.
What skills do you need for the Microelectronics Advanced Packaging Engineer role at Booz Allen Hamilton?expand_more
Key skills for Microelectronics Advanced Packaging Engineer at Booz Allen Hamilton include Ecad; Mcad; Packaging; PCB Fabrication; Cleanroom Processing; SMT Assembly; Flip-Chip; and Bga.
What education is required for Microelectronics Advanced Packaging Engineer at Booz Allen Hamilton?expand_more
Educational requirements for this role: Bachelor's degree in an engineering field required; and Master's degree in an engineering field preferred.
What category does the Microelectronics Advanced Packaging Engineer role belong to?expand_more
Microelectronics Advanced Packaging Engineer at Booz Allen Hamilton is part of the engineering job category on Recrutus.
Recrutus

Curating the world's most innovative career opportunities. We bridge the gap between visionary talent and industry-leading companies.

Search roles by city, category, skill, or job type — explore verified US employers, salary benchmarks, and remote-friendly teams hiring nationwide.

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Browse jobsCompanies hiringRemote jobsJobs by locationJobs by cityJobs by categoryJobs by skillCareer guidesCareer blogSalary insights
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About usFAQContactPrivacy policyUS privacy notice

Recrutus helps candidates discover roles that match their skills and helps teams reach qualified applicants faster. Browse by metro, discipline, or work style — from internships to senior leadership.

© 2026 Recrutus. All rights reserved.
Terms of serviceCookie policyAcceptable useDMCA policyEmployer termsCandidate terms
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EcadMcadPackagingPCB FabricationCleanroom ProcessingSMT AssemblyFlip-ChipBgaWLPSystem-In-Package
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