
location_on3866, Brookshire Drive, Bellbrook, Greene County, Ohio, 45305, United States
As a Microelectronics Advanced Packaging Engineer, you will apply principles of engineering physics, mathematics, and materials science to support the design, analysis, and manufacturing of mechanical systems. In this role, you will develop solutions for problems of moderate scope and complexity, working independently while providing guidance to junior employees. You will be instrumental in evaluating new packaging materials, processes, and architectures to align with state-of-the-art technologies in dynamic manufacturing and R&D environments.
Your day-to-day work involves operating and maintaining complex equipment in microelectronics rapid prototyping laboratories. You will manage the complete packaging assembly process from concept to prototype, including equipment and material selection for panel-level, wafer-level, and chip-level systems. This includes expertise in flip-chip, BGA, WLP, system-in-package (SiP), multi-chip modules (MCM), and heterogenous and chiplet integration. A key focus will be developing packaging solutions that optimize Size, Weight, and Power (SWaP) within a high-mix, low-volume R&D setting.
Applicants selected for this position will be subject to a security investigation and must meet eligibility requirements for access to classified information. A Secret clearance is required, and candidates may need to obtain one if not already held.
As part of our hiring process, we utilize advanced biometrics and artificial intelligence to ensure authenticity and protect against identity fraud. Candidates are expected to be on camera during interviews and assessments, and we reserve the right to take pictures to verify identity.
At Booz Allen, AI is a part of our daily work, and we are committed to its responsible and ethical use. However, to ensure a fair candidate process based on your own skills and knowledge, the use of AI tools to assist with responses during interviews is prohibited unless explicit permission is provided.
Our people-first culture prioritizes collaboration, whether in person or virtually. Employees working virtually are generally expected to have their cameras on during meetings. Depending on the specific assignment, this role may be Remote, Hybrid, or Onsite.
All qualified applicants will receive consideration for employment without regard to disability, status as a protected veteran, or any other status protected by applicable federal, state, local, or international law.
Work model: On-site
3866, Brookshire Drive, Bellbrook, Greene County, Ohio, 45305, United States
Bellbrook, Ohio
5+ years of experience with advanced packaging technology innovation and prototyping. Experience collaborating with RF, digital, photonics, and analog designers to tailor packaging designs to application needs. Knowledge of trends related to current and future technologies, including design or prototyping for DoD systems. Secret clearance. Master's degree in an engineering field.
Skills: Ecad, Mcad, Packaging, PCB Fabrication, Cleanroom Processing, SMT Assembly, Flip-Chip, Bga, WLP, System-In-Package.
Education: Bachelor's degree in an engineering field required; Master's degree in an engineering field preferred.