
The Director of Package Materials Integration leads the strategy and execution for Micron's advanced packaging materials roadmap within the Advanced Packaging Technology Development team. This global role oversees a diverse portfolio of materials including chemistries, films, and composites while managing direct reports across the U.S. and Asia. Key responsibilities include defining the materials roadmap, driving supplier engagement for new technologies, and resolving critical materials-package interaction issues to support high-volume manufacturing. The position appeals to leaders seeking to shape the future of 3D memory products like HBM and 3DS DRAM in a collaborative environment that prioritizes technical excellence and professional growth. The role involves cross-functional partnership with process engineering and manufacturing teams to deliver innovative semiconductor solutions.
















