Director - Package Materials Integration, APTD
Not Disclosed•Full-TimeOn-site
location_on690, South 13th Street, Downtown, Boise, Ada County, Idaho, 83702, United States
Our vision is to transform how the world uses information to enrich life for all. As a world leader in innovating memory and storage solutions, we accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever.
As the Director of Package Materials Integration in Advanced Packaging Technology Development (APTD), you will lead the strategy, execution, and organizational capability for Micron's advanced packaging materials roadmap for advanced 3D memory products, including HBM and 3DS DRAM. This role is critical for bridging the gap between materials science and high-volume manufacturing, ensuring that our global teams can deliver on complex product timelines.
You will lead a diverse global team with direct reports in both the U.S. and Asia, working closely with cross-functional partners across process development, equipment development, manufacturing, global quality, and purchasing. Your day-to-day involves setting the advanced packaging materials roadmap, driving supplier engagement to meet roadmap needs, and resolving critical materials-package interaction issues. You will partner with process engineering and equipment development leaders to ensure all technical deliverables are met while fostering a culture of technical excellence and clear execution disciplines across regions.
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. We offer a choice of medical, dental, and vision plans in all locations, enabling team members to select the plans that best meet their family healthcare needs and budget. Our benefit programs also include income protection if you are unable to work due to illness or injury, paid family leave, and a robust paid time-off program with paid holidays.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity, or any other factor protected by applicable federal, state, or local laws.
Candidates are encouraged to use AI tools to enhance their resume and/or application materials; however, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
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For US sites only, to request assistance with the application process and/or for reasonable accommodations, please contact Micron's People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3). To learn about your right to work, please visit the Department of Justice website. For more information about Micron, please visit micron.com/careers.
Work model: On-site
690, South 13th Street, Downtown, Boise, Ada County, Idaho, 83702, United States
Boise, Idaho
PhD degree. Experience with advanced memory packaging.
Skills: 2.5d/3d Heterogeneous Integration Technologies, Wlfo, Soic, Cowos, Wow, Info, Chiplet, Sip Architectures, Materials Characterization Techniques, Simulation.
Education: Master of Science in chemistry, chemical engineering, or materials science and engineering required; PhD in chemistry, chemical engineering, or materials science and engineering preferred.
